Bondexpo 2026
Discover cutting-edge adhesive solutions at Bondexpo 2026 in Stuttgart, Germany!
About the event
Bondexpo 2026 is a premier trade fair dedicated to innovative solutions in adhesive bonding, potting, sealing, and foaming within the joining process chain. Set to take place from October 6 to October 8, 2026, at the New Stuttgart Trade Fair Center, this event is a vital platform for industry professionals seeking to explore the latest advancements in the field. Bondexpo has established itself as a key event for the adhesive industry, showcasing the evolution of bonding technologies since its inception.
Attendees can expect a dynamic atmosphere filled with opportunities for networking and discovery. With a diverse range of exhibitors and a focus on cutting-edge technologies, Bondexpo offers a unique chance to connect with industry leaders and innovators. Engage in meaningful conversations, share insights, and build valuable relationships that can drive your business forward.
A standout feature of Bondexpo is its emphasis on the latest trends and solutions that are shaping the adhesive bonding landscape. This event not only highlights innovative products but also addresses the challenges and opportunities within the industry, making it a crucial gathering for professionals in Stuttgart and beyond. Whether you are looking for new suppliers or seeking inspiration for your next project, Bondexpo 2026 is the place to be.
Join us in Stuttgart, the heart of Germany’s industrial innovation, and be part of the conversation that is redefining the future of adhesive technologies. Don’t miss out on this opportunity to elevate your business and stay ahead in the rapidly evolving adhesive market.
Event Details
- Dates: October 06, 2026 - October 08, 2026
- Location: New Stuttgart Trade Fair Center, Stuttgart, Germany
- Venue: New Stuttgart Trade Fair Center
- Website: http://www.bondexpo-messe.com
Who attends?
When and where
- Tuesday 09:00 – 17:00
- Wednesday 09:00 – 17:00
- Thursday 09:00 – 17:00
How to get here
Event themes and focus areas
Business and marketing opportunities
Bondexpo 2026 connects exhibitors with Information & Communication Technology decision-makers and buyers, offering brand visibility, lead generation, and networking opportunities within the Information & Communication Technology sector.
Frequently asked questions
What is Bondexpo 2026?
Bondexpo 2026 is a trade fair focused on innovative solutions for adhesive bonding, potting, sealing, and foaming in the joining process chain.
When and where does Bondexpo 2026 take place?
Bondexpo 2026 will be held from October 6 to October 8, 2026, at the New Stuttgart Trade Fair Center in Stuttgart, Germany.
Who should attend Bondexpo 2026?
Bondexpo 2026 is ideal for professionals in the adhesive industry, including engineers, product managers, and procurement specialists.